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YZ001 & YZ002 Uniform Particle Resin | Vietnam Semiconductor Ultra-Pure Water Project
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YZ001 & YZ002 Uniform Particle Resin | Vietnam Semiconductor Ultra-Pure Water Project

2026-07-16

Latest company case about YZ001 & YZ002 Uniform Particle Resin | Vietnam Semiconductor Ultra-Pure Water Project

Project Background
A large semiconductor wafer manufacturing factory in Vietnam built a new electronic-grade ultra-pure water station. The factory needs continuous supply of 18MΩ·cm high-purity water for chip cleaning, silicon wafer production and laboratory testing. The original ordinary mixed bed resin had uneven particle size, poor high temperature resistance, unstable water resistivity and frequent resin breakdown, which seriously affected product yield and continuous production. The client needed matched uniform particle ion exchange resin with high temperature resistance and high mechanical strength.
On-Site Challenges
The production line runs all year round, requiring stable ultra-pure water above 18 MΩ·cm without fluctuation.
Partial condensate working temperature reaches over 120℃, common resin is easy to crack and expand seriously.
Uneven resin beads lead to high bed pressure drop, frequent backwashing and short service cycle.
Heavy metal ions such as calcium and nickel in raw water are difficult to deeply remove, causing wafer surface defects.
Customized Solution
We adopted matched YZ001 uniform grain high-temperature strong acid cation resin and YZ002 uniform grain strong base anion resin to build two-stage mixed bed system. YZ001 features 1.1 uniform coefficient, high compressive strength and maximum working temperature up to 140℃; matched YZ002 removes anions such as fluoride and sulfate completely. We adjusted regeneration flow rate and acid-alkali concentration according to local water quality to improve exchange efficiency and anti-pollution performance.
Application Results
Outlet water resistivity stably keeps above 18.2 MΩ·cm, fully meets electronic-grade semiconductor water standard.
Resin crushing rate drops sharply, bed pressure drop stays steady, service life extended from 1 year to 3 years.
Deep removal of Ca²⁺, Ni²⁺, F⁻ and other impurities, wafer defective rate reduced by 28%.
Regeneration acid and alkali consumption cut by 25%, greatly lowering daily operation cost of water station.

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